Integrated methodology for board assignment and component allocation in printed circuit board assembly

An approach to minimize makespan for assigning boards to production lines is described. Because of sequence-dependent set-up times, board assignment and component allocation have to be performed concurrently. An integrated methodology is developed to obtain a solution to these two problems. The methodology consists of seven phases: printed circuit board grouping, family decomposition, subfamily sequencing, Keep Tool Needed Soonest procedure, component set-up determination, component allocation and board assignment. Application of the methodology to industrial problems demonstrates that it can solve large-scale problems efficiently. In addition, the effect of two key parameters, feeder capacity and threshold value, on the performance of the solution procedure was examined. The results indicate that feeder capacity has an impact on total workload imbalance but not on the global makespan. Threshold value, a measure of effectiveness of joining a component type to a component group for a printed circuit board family, has a significant effect on the global makespan. The interactions of threshold value, and variations in printed circuit board requirement and component usage also affect global makespan.