Article ID: | iaor20171543 |
Volume: | 33 |
Issue: | 4 |
Start Page Number: | 693 |
End Page Number: | 708 |
Publication Date: | Jun 2017 |
Journal: | Quality and Reliability Engineering International |
Authors: | Wang Zhihua, Fu Huimin, Zhang Yongbo, Ma Xiaobing, Li Junxing, Krishnaswamy Sridhar |
Keywords: | simulation, stochastic processes |
Degradation analysis is very useful in reliability assessment for complex systems and highly reliable products, because few or even no failures are expected in a reasonable life test span for them. In order to further our study on degradation analysis, a novel Wiener process degradation model subject to measurement errors is proposed. Two transformed time scales are involved to depict the statistical property evolution over time. A situation where one transformed time scale illustrates a linear form for the degradation trend and the other transformed time scale shows a generalized quadratic form for the degradation variance is discussed particularly. A one‐stage maximum likelihood estimation of parameters is constructed. The statistical inferences of this model are further discussed. The proposed method is illustrated and verified in a comprehensive simulation study and two real applications for indium tin oxide (ITO) conductive film and light emitting diode (LED). The Wiener process model with mixed effects is considered as a reference. Comparisons show that the proposed method is more general and flexible, and can provide reasonable results, even in considerably small sample size circumstance.