| Article ID: | iaor201523769 |
| Volume: | 12 |
| Issue: | 6 |
| Start Page Number: | 447 |
| End Page Number: | 452 |
| Publication Date: | Nov 1996 |
| Journal: | Quality and Reliability Engineering International |
| Authors: | Quintard V, Parmentier B, Phan T, Lewis D, Dilhaire S, Claeys W |
| Keywords: | measurement |
We present the results of a non‐destructive measuring method allowing us to characterize the evolution of solder joints during thermal cycling ageing tests. The method uses a high resolution optical probe to detect selectively pure Joule and Peltier thermal responses of the solder joint subject to a given current pulse. The results show the Peltier and Joule responses to be good indicators for the evaluation of the age and the degradation of solder joints.