Optimum parameter values for a metal plating process

Optimum parameter values for a metal plating process

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Article ID: iaor20091241
Country: South Korea
Volume: 34
Issue: 3
Start Page Number: 337
End Page Number: 343
Publication Date: Sep 2008
Journal: Journal of the Korean Institute of Industrial Engineers
Authors: , , ,
Keywords: mineral industries, production
Abstract:

The problem of determining the optimum metal plating thicknesses on the plane and curved surfaces of an electronic part is considered. A lower specification limit for the plating thickness is usually pre-specified. In most applications, the plating thickness on the curved surface is proportional to that on the plane surface. The proportion can be adjusted by adding chemical catalysts to the plating fluid. From the economic point of view, nonconforming items with a thickness smaller than the lower specification limit incur rejection costs, such as rework and scrap costs, while a thicker plating may incur excessive material costs. In this article, an economic model is proposed for simultaneously determining the target plating thickness and the ratio of the plating thickness on the plane surface to that on the curved surface. An illustrative example demonstrates the applicability of the proposed model.

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