Modeling and optimization of stencil printing operations: A comparison study

This paper presents a comparison study for the optimization of stencil printing operations using hybrid intelligence technique and response surface methodology (RSM). An average 60% of soldering defects are attributed to solder paste stencil printing process in surface mount assembly (SMA). The manufacturing costs decrease with increasing first-pass yield in the stencil printing process. This study compares two hybrid intelligence approaches with RSM as methods of solving the stencil printing optimization problem that involves multiple performance characteristics. The optimization process is threefold.