Optimal burn-in decision making

Optimal burn-in decision making

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Article ID: iaor20011372
Country: United States
Volume: 14
Issue: 6
Start Page Number: 417
End Page Number: 423
Publication Date: Nov 1998
Journal: Quality and Reliability Engineering International
Authors: ,
Keywords: design, maintenance, repair & replacement
Abstract:

This paper presents a conceptual model of burn-in decision making which gives an optimal burn-in time for semiconductor devices and describes how burn-in affects total yield and reliability. For the gate oxide of integrated circuits we consider four burn-in policies: no burn-in, wafer-level burn-in only, package-level burn-in only and wafer-level burn-in prior to package-level burn-in. A decision-making model to minimize cost is given for each burn-in policy. Burn-in time is strongly limited by the cost factor and reliability requirements. In order to reduce the cost incurred in burn-in, a short test time and small test samples are recommended.

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